SORTER - 三和技研股份有限公司

The equipment can be connected to OHT or AGV.
Wafer holding is basically vacuum suction or edge-clamp.
The internal mini-environment cleanliness control is verified by the CFD analysis, which ensures the internal and external pressure-differential design to prevent from pollution during the wafer transfer process.
The compact design can reduce footprint and saves costs.
Optimized moving track of the robot, enabling a speedy and stable transfer with the curve interpolation for the shortest route.
LOAD PORT configuation capability from 2 to 8 ports.
Optional with the high-speed wafer pre-aligner, which uses the dynamic image algorithm, can accurately and quickly allocate the wafer center and direction.
Optional with the optical and image processing & identification system, enhances the identification rate of wafer ID.
Complete data track to satisfy the requirement of predictive maintenance of Industry 4.0.
Customized services, providing discussions for customized specifications.

Internal mini-environment cleanliness control verified by the CFD analysis with effective internal and external pressure-differential design to prevent from pollution in the wafer transfer process.
Optimized Robot+I30:I31 direction.
Complete data track to satisfy the requirement of predictive maintenance in Industry 4.0.

Simultaneously correspond to the transfer of 8" & 12" wafers
Internal mini-environment cleanliness control verified by the CFD analysis with effective internal and external pressure-differential design to prevent from pollution in the wafer transfer process.
Optimized moving trajectory of the robot, enabling a speedy and stable transfer with the curve interpolation for the shortest route
The ultra-high speed wafer aligner, which uses the dynamic image algorithm to allocate the wafer center and direction accurately and quickly.
Complete data track to satisfy the requirement of predictive maintenance in Industry 4.0.

Internal mini-environment cleanliness control verified by the CFD analysis with effective internal and external pressure-differential design to prevent from pollution in the wafer transfer process.
Optimized Robot+I30:I31 direction.
Complete data track to satisfy the requirement of predictive maintenance in Industry 4.0.