200mm ​

• Simultaneously correspond to the transfer of 8" & 12"wafers.
• Internal mini-environment cleanliness control verified by the CFD analysis with effective internal and external pressure-differential design to prevent from pollution in the wafer transfer process.
• Optimized moving trajectory of the robot, enabling a speedy and stable transfer with the curve interpolation for the shortest route.
• The ultra-high speed wafer aligner, which uses the dynamic image algorithm to allocate the wafer center and direction accurately and quickly.
• Complete data track to satisfy the requirement of predictive maintenance in Industry 4.0.