300mm

• Fixed wafer transfer process with vacuum and edge-clamp types available to customers depending on actual needs.

• Internal mini-environment cleanliness control verified by the CFD analysis with effective internal and external pressure-differential design to prevent from pollution in the wafer transfer process.

• Optimized moving trajectory of the robot, enabling a speedy and stable transfer with the curve interpolation for the shortest route.

• Complete data track to satisfy the requirement of predictive maintenance in Industry 4.0.

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