HA (Vac)

• Adopting high●High-resolution CCD optical identification and localization system.
• UnigueUnique algorithm for guickquick positioning and alignment.
• Corresponding to transparent, ultra-thick, ultra-thin, warped wafer workpieces.
• With greatGreat sensing capabilities which support on if the wafer hassupporting workpieces with a notch, flat, or dual flatsflat side workpiece.